权威例句
Barrier layers for electroplated SnPb eutectic solder jointsFuture directions in electroplated materials for thin-film recording headsFuture directions in electroplated materials for thin-film recording headsMechanisms for Microstructure Evolution in Electroplated Copper Thin FilmsSynthesis, structure and properties of electroplated nanocrystalline materialsRecrystallization kinetics of electroplated Cu in damascene trenches at room temperatureFailure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)Cu 2 ZnSnS 4 thin film solar cells from electroplated precursors: Novel low-cost perspectiveComplementary metal oxide semiconductor device with an electroplated metal replacement gateThe crystallisation of Cu 2 ZnSnS 4 thin film solar cell absorbers from co-electroplated Cu–Zn–Sn precursors