bumping

听听怎么读
英 ['bʌmpɪŋ]
美 ['bʌmpɪŋ]
是什么意思
  • n.

    爆沸;突沸;放气;崩沸

  • v.

    撞倒,冲撞( bump的现在分词 );颠簸着前进;

  • 英英释义

    bump[ 'bʌmpiŋ ]

    • n.
      • a lump on the body caused by a blow
      • something that bulges out or is protuberant or projects from its surroundings

        同义词:bulgehumpgibbositygibbousnessjutprominenceprotuberanceprotrusionextrusionexcrescence

      • an impact (as from a collision)

        "the bump threw him off the bicycle"

        同义词:blow

    • v.
      • knock against with force or violence

        "My car bumped into the tree"

        同义词:knock

      • come upon, as if by accident; meet with

        同义词:findhappenchanceencounter

      • dance erotically or dance with the pelvis thrust forward

        "bump and grind"

      • assign to a lower position; reduce in rank

        同义词:demoterelegatebreakkick downstairs

      • remove or force from a position of dwelling previously occupied

        同义词:dislodgedisplace

    学习怎么用

    词组短语

    bump into无意中遇到、碰到

    with a bump意外地,突然

    bump against撞;碰

    bump up突然增加;提升

    bump off干掉]

    bump mapping凹凸贴图;凸凹处理;凹凸映射

    更多收起词组短语

    双语例句

    用作名词(n.)
    1. She saw a moth bumping against the window.
      她看到一只飞蛾撞击着窗户。
    2. This article argues about application of judicature to taxi-drivers' bumping into bandits.
      摘要本文对的士司机撞击抢劫犯司法适用的相关问题加以论述。

    权威例句

    Low-cost wafer bumping
    Bumping Up Against the Barrier with the Binomial Method
    Model Search by Bootstrap "Bumping"
    Balancing Between Bagging and Bumping
    Wafer level lead free solder bumping process & characterization
    Waferlevel method for direct bumping on copper pads in integrated circuits
    Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
    Information Encountering: It's More Than Just Bumping into Information
    Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
    Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)