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Determination of the uncertainties of the constitutive relationships in the CALTHARE 2 codeChallenges for 3D IC integration: bonding quality and thermal managementNovel 3D integration process for highly scalable Nano-Beam stacked-channels GAA (NBG) FinFETs with HfO2/TiN gate stackDesign of Computer Experiments: A powerful tool for the numerical design of BAW filtersLe patrimoine du futur: approches pour une gestion patrimoniale des ressources naturellesRecommandations aux médecins généralistes pour la prise en charge de première intention de la dysfonction érectile (réactualis...An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and CharacterizationGuidelines for general practitioners for first-line management of erectile dysfunction (updated 2010) ☆Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integrationThe BEMUSE programme: Best-estimate methods uncertainty and sensitivity evaluation - Phase 2